Need To Test Your Bond Wires And Solder Bumps? 4 Steps To Avoid Problems With The Testing

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When it comes to working with metals, you've got to make sure that the bond wires and the solder bumps are strong enough to withstand the force that will be placed upon them. The only way to do that is conduct periodic testing using ball shear testing or tweezer pull testing. When testing the strength of your bond wires and solder bumps, it's crucial that you care great care with the testing measures. That way, you're sure that the results are accurate, and the test data wasn't compromised. Here are four steps you should follow that will ensure problem-free testing of your bond wires and solder bumps.

Inspect Your Tools Before Performing the Test

Before you begin the testing process, you need to make sure that the tools you're using are up for the task. The best way to do that is to inspect them before each test. Pay close attention to the gripping edges of the equipment. If the gripping edges are damaged in any way, it could undermine the integrity of the testing procedure, which may give you an incorrect reading. When it comes to bonds, incorrect reading on the strength testing could lead to devastating results.

Ensure Proper Alignment of the Testing Equipment

Once you've inspected the testing tools, you'll need to ensure that the equipment is properly aligned. Using equipment that hasn't been aligned could cause problems with the test results, and could damage the bond that's being tested.

Practice Proper Force Control During the Test

When it comes to testing the strength of your bonding wires and solder bumps, you need to practice proper force control during the test. If too much force is exerted, the wire could be damaged. If not enough force is exerted, you might not maintain the control you need for precise results. To avoid force control issues, utilize testing equipment that provides automatic force control. This will ensure that the right amount of force is used during each testing procedure, which is important when testing the bond of different types of metal.

Handle the Testing Equipment With Great Care

When handling the testing equipment, it's important that you take great care. This is particularly important when conducting tweezer testing on bonds. The equipment can be damaged or destroyed if it's mishandled. It's also important to avoid touching the testing equipment with your bare hands, as it can be contaminated. If your testing equipment does get contaminated, you should clean it carefully before use.

Contact a company, like xyztec bv, for more help.